Sn97 - Cu3 Tinning or Solder Pastes - Sn97Cu3

Sn30 Tinning or Solder Pastes
Ref. : NC
Sn97 - Cu3 Tinning or Solder Pastes - Sn97Cu3
sans_plomb
Metaconcept’s Sn97 – Cu3 – Sn97Cu3 tinning and soldering paste is a homogeneous blend of 97% tin and 3% copper, combined with a flux stripper and a binder. Specially designed for lead-free soldering, it guarantees precise application and excellent solder quality. Ideal for assembling metals such as copper and its alloys, this paste is particularly well suited to the electronics, aeronautics, rail, electrical and mechanical assembly sectors.

Features

Solidus – Liquidus :

230°C – 250°C

Composition :

97% tin – 3% copper*

Alliage sans Pb :

Classification et normes :

Lead-free alloys – European standard no. 2000 / 53 / CE

Informations et particularités :

All metals except aluminium – Lead-free*
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